In order to revive its semiconductor leadership position, Intel is currently investing billions of dollars to build its own wafer fabs and expanding its wafer foundry business. In February, it announced a $5.4 billion (35.4 billion RMB) acquisition of Israel's Tower Semiconductor, which has now been approved by its shareholders.
According to reports, Tower Semiconductor announced that its shareholders' special meeting has approved the agreement to sell the company to Intel, and both parties need to obtain all necessary regulatory approvals before the transaction is completed.
Until the completion of the transaction, Intel's Manufacturing Services Division (IFS) and Tower Semiconductor will operate independently.

During this period, Intel's Manufacturing Services Division (IFS) will continue to be led by Thakur, while Tower Semiconductor will continue to be led by Ellwanger.
After the transaction, Intel aims to make these two organizations a fully integrated foundry business. At that time, Intel will share more details about the integration plan.
It is reported that Gaota Semiconductor Co., Ltd. is a semiconductor professional OEM factory in Israel, headquartered in Migdal Emek, Israel.
The company currently operates only one 6-inch wafer fab (process between 1 micron and 0.35 microns) and one 8-inch wafer fab (process between 0.18 microns and 0.13 microns) in Israel, with one 8-inch wafer fab each in California and Texas, providing process services for 0.18 microns (Texas plant) and 0.18 to 0.13 microns (California plant).
Gaota Semiconductor ranks seventh in the global wafer foundry market, with an annual revenue of approximately 1.3 billion US dollars. Although its scale is not large, it is in a leading position in special processes and ranks first in the field of analog chip foundry. Its RF and high-performance analog circuit technologies can support a wide range of high-speed, low-power products for consumer, industrial facility, and automotive electronics applications.